CI Semi provides cost effective solutions for the semiconductor industry demanding needs. CI's versatile products serve the following different semiconductor processes:
Cleaning procedures are essential steps in semiconductor processing. These are mostly used to remove particles and oxidize organic contaminants. Two of the most common clean chemistries are SC1 (H2O2/NH4OH) and SC2 (H2O2/HCL).
Photoresist stripping is frequently accomplished using solvents with multiple proprietary components as well as some water content. These are expensive chemicals which are also expensive to dispose off.
Wet etch is typically used to remove a top layer from a semiconductor wafer, without harming the structure underneath that film, or etch cavities into a wafer - parts of which are protected by a mask.
Rapid Thermal Processing is a common process step in semiconductor device fabrication. It involves heating a wafer up to temperatures as high as 1200C or more within a few seconds, sometimes less.
Deposition processes include such steps as PVD (Physical vapor deposition, metallization) and CVD (chemical vapor deposition – dielectrics, tungsten).
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CI Semi provides cost effective solutions for the semiconductor industry demanding needs. CI's versatile products serve the following different semiconductor processes: