Rapid Thermal Processing is a common process step in semiconductor device fabrication. It involves heating a wafer up to temperatures as high as 1200C or more within a few seconds, sometimes less. In order to avoid overheating the wafer, exceeding the thermal budget or not hitting a high enough temperature point for the process, temperature control is critical. In order to achieve good temperature control, fast and accurate temperature measurement is essential.
Rapid thermal process steps include both anneal and deposition:
- RTP (Rapid Thermal Processing): Umbrella term for high-temperature semiconductor processes involving rapid wafer heating. Used for dopant activation, silicide formation, and oxide growth.
- RTA (Rapid Thermal Annealing): Specific RTP process for annealing semiconductors. Quickly heats wafers to 900°C-1300°C to activate dopants and repair crystal damage.
- RTCVD (Rapid Thermal Chemical Vapor Deposition): Combines RTP with CVD for rapid thin film growth. Ideal for epitaxial layers, dielectrics, and metal films.
Rapid Thermal Processing Monitoring Equipment
The integration of these CI Semi’s products significantly enhances RTP processes:
- Provides continuous temperature data for dynamic adjustments during RTP cycles
- Helps identify and correct non-uniform heating issues
- Enables fine-tuning of RTP recipes for optimal performance and yield
- Ensures consistent and accurate temperature monitoring for product quality
- Supports equipment maintenance and calibration
- Enables integration with Advanced Process Control (APC) systems for adaptive process control and improved manufacturing efficiency.
Summary
In conclusion, precise temperature control is crucial in all RTP processes for several key reasons. It ensures process reproducibility by maintaining consistent temperature profiles across wafers and batches.
Effective thermal budget management prevents unwanted diffusion and maintains desired device characteristics. Uniform heating across the wafer surface is essential for consistent processing and device performance.
Lastly, accurate temperature control prevents thermal damage such as wafer warpage or slip. By leveraging advanced monitoring tools like those offered by CI Semi, semiconductor manufacturers can push the boundaries of RTP technology, enabling the development of more advanced and efficient semiconductor devices while maintaining the critical balance of temperature control throughout the process.